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MIJING M21 Universal Magnetic Base Phone Mid Frame Reballing Tool Option:Huawei mid-stencil 33pcs Repair IMEI [Diag Mode]

SKU: 18688001217

4.7
USD12.99 USD32.99

Pay in 4 interest-free payments of $3.25 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Oct 24 - Oct 29

Description

Repair IMEI [Diag Mode]

Manual FA Lens 12MP C-mount 50mm High-contrast Manual Focus Lens 1"  F2

Power Adapter: 60W (Max)

USB: 1280*720P@30FPS

SGH-A-series: SGH-A157

MIJING M21 Universal Magnetic Base Phone Mid Frame Reballing Tool Option:Huawei mid-stencil 33pcs Repair IMEI [Diag Mode]MiJing M21 universal magnetic base mobile phone motherboard middle layer frame reballing platform. MiJing universal magnetic base with magnetic middle layer steel mesh stencil and scraper blade tin paste knife for cell phone logic board middle layer mid frame BGA Tin planting repair. Mijing GX01 GX02 Non magnetic tin paste scraper knife set for motherboard IC glue removing tin planting. Features: 1. Temperature resistance and strong magnetism. 2.

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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